PART |
Description |
Maker |
SOD523 |
Surface mounted, 2 pin package Package outline
|
Zetex Semiconductors
|
MSA20 |
20-Lead Shrink Small Outline Package (SSOP), EIAJ TYPE II, 5.3mm Wide Package Number MSA20 20 -铅收缩小型封装(SSOP封装),EIAJ型二.3mm宽包MSA20
|
Fairchild Semiconductor, Corp. Fairchild Semiconductor Corporation
|
DFN2X2-10 |
Package Outline
|
Global Mixed-mode Techn...
|
TQFN5X5-32 |
Package Outline
|
Global Mixed-mode Techn...
|
TQFN4X4-24 |
Package Outline
|
Global Mixed-mode Techn...
|
TQFN4X4-32 |
Package Outline
|
Global Mixed-mode Techn...
|
TQFN3X3-16 |
Package Outline
|
Global Mixed-mode Techn...
|
TQFN3X4-20 |
Package Outline
|
Global Mixed-mode Techn...
|
WLCSP15X15-163 |
Package Outline
|
Global Mixed-mode Techn...
|
PG-LQFP-64-12 PG-LQFP-64-19 PG-LQFP-64-22 PG-LQFP- |
Package Outline
|
Infineon
|